【Khoom taw qhia】
KHOOM MUAJ NQI
Parameter | Yam ntxwv | ASTM Kev Them Nqi |
Hom / Dopant | P, Boron N, Phosphorous N, Antimony N, Arsenic | F42 |
Kev Taw Qhia | <100>, <111> hla kev taw qhia ib tus neeg siv khoom ntiag tug | F26 |
Pa Cov Ntsiab Lus | 10 19 ppmA Cov kev tuaj yeem ua rau tus neeg muaj kev paub meej | F121 |
Cov Ntsiab Lus Cov Khoom Ua Ntej | <0.6> | F123 |
Tawv Raus Tiv Thaiv - P, Boron- N, Phosphorous- N, Antimony- N, Arsenic | 0.001 - 50 ohm · cm | F84 |
COV KHOOM NEEG KHOOM UA NTEJ
Parameter | Prime | Saib / Kuaj A | Kev xeem | ASTM txujci |
Ncauj | 150 ± 0.2 hli | 150 ± 0.2 hli | 150 ± 0.5 hli | F613 |
Thickness | 675 ± 20 μm (tus qauv) | 675 ± 25 μm (txheem) 450 ± 25 μm 625 ± 25 μm 1000 ± 25 μm 1300 ± 25 μm 1500 ± 25 μm | 675 ± 50 μm (txuj) | F533 |
TTV | <5> | <10> | <15> | F657 |
Hneev nti | <30> | <30> | <50> | F657 |
Qhwv | <30> | <30> | <50> | F657 |
Ntug Rounding | SEMI-STD | F928 | ||
Npav | Primary SEMI-Tiaj Tsho nkaus xwb, SEMI-STD Flats Jeida Tiaj Tsho, Ncej | F26, F671 | ||
DAB TSI ZOO
Parameter | Prime | Saib / Kuaj A | Kev xeem | ASTM txujci |
Pem Sij Hawm Sab Nraud | ||||
Cov teeb meem saum npoo av | Tshuaj Mechanical Polished | Tshuaj Mechanical Polished | Tshuaj Mechanical Polished | F523 |
Deg Roughness | <2 a=""> | <2 a=""> | <2 a=""> | |
Kev puas tsuaj, Phiv @> 0.3 μm | = 20 | = 20 | = 30 | F523 |
Npau Taws, Dej Txhaum, Txiv Hlis Txiv Plaub | Tsis muaj | Tsis muaj | Tsis muaj | F523 |
Pom Cov Cim, Kev Hloov | Tsis muaj | Tsis muaj | Tsis muaj | F523 |
Rov Qab Saum Npe | ||||
Cracks, crowsfeet, pom cov cim, cov xim | Tsis muaj | Tsis muaj | Tsis muaj | F523 |
Cov teeb meem saum npoo av | Caustic etched | F523 | ||
【 Product description 】
Zoo meej rau kev siv microfluidics. Rau microelectronics los yog MEMS daim ntawv thov, thov hu rau peb kom paub meej specs.
Cov khoom siv nruab nrab txuas mus ntxiv ntsws, nws yog ib qho tseem ceeb rau cov wafers kom muaj qhov zoo siab rau ob sab pem hauv ntej thiab sab nraud. Tam sim no cov wafers muaj feem ntau hauv microelectromechanical systems (MEMS), wafer bonding, silicon ntawm insulator (SOI) fabrication, thiab cov kev siv nrog ceev ntaj. Microelectronics lees paub qhov evolution ntawm kev lag luam hauv kev lag luam thiab nws tau cog lus los nrhiav cov haujlwm ntev rau txhua tus neeg yuav tsum tau ua.
Loj Tshuag ntawm ob sab sab polished wafers nyob rau hauv tag nrho wafer diameters li ntawm 100mm mus txog 300 hli. Yog tias koj qhov kev qhia tsis muaj nyob hauv peb cov khoom muag, peb tau tsim cov kev sib raug zoo ntev nrog ntau cov neeg muag khoom uas muaj peev xwm ntawm kev tsim khoom wafers kom haum rau txhua yam tshwj xeeb. Ob sab sab polished wafers muaj nyob rau hauv silicon, iav thiab lwm yam ntaub ntawv uas feem ntau siv hauv kev lag luam ntawm cov khoom siv hluav taws xob.
Customized dicing thiab polishing yog ib qho tseem avaible raws li koj xav tau. Thov tuaj yeem tiv tauj peb.
【 Khoom nta 】
· 6 "P / N hom, Polished silicon wafer (25 phaj)
· Orientation: 150
· Txuj ci: 0.1 - 40 ohm · cm (Nws yuav txawv ntawm batch mus ua pob)
· Thickness: 675 +/- 20um
· Prime / Saib / Kev Ntsuam Xyuas Qib
Cim npe nrov: 6 nti (150mm) wafer, Suav teb, lwm tus neeg, manufacturers, hoobkas, ua nyob rau hauv Suav teb
