4 nti (100mm) Wafer

4 nti (100mm) Wafer
Khoom Taw qhia:
Microelectronics 'khoom kab muaj ob qho tib si sab polished (SSP) thiab ob sab sab polished (DSP) wafer substrates. ● 4 "P hom, Polished silicon wafer (25 pcs) ● Orientation: 100 ● Resistivity: 0.1 - 40 Ohm • cm (Nws yuav txawv ntawm ib pawg rau ib pob) ● Thickness: 525 +/- 20um ● Prime / Saib / Kev xeem Qib
Xa kev nug
Tsham tam sim no
Hauj lwm lawm
Kev tsis

【Khoom taw qhia】

4 nti (100mm) Polished Wafer DSC01065 730


4 nti (100mm) Polished Wafer DSC01070 730


KHOOM MUAJ NQI

Parameter

Yam ntxwv

ASTM Kev Them Nqi

Hom / Dopant

P, Boron N, Phosphorous N, Antimony N, Arsenic

F42

Kev Taw Qhia

<100>, <111> hla kev taw qhia ib tus neeg siv khoom ntiag tug

F26

Pa Cov Ntsiab Lus

10 18 ppmA Cov kev tuaj yeem ua rau tus neeg muaj kev paub meej

F121

Cov Ntsiab Lus Cov Khoom Ua Ntej

<0.5 ppma="" kev="" cai="" tolerances="" ib="" tus="" neeg="" muaj="" kev="" tshwj="">

F123

Tawv Raus Tiv Thaiv - P, Boron- N, Phosphorous- N, Antimony- N, Arsenic

0.001 - 50 ohm · cm
0.1 - 40 ohm · cm
0.005 - 0.025 ohm · cm
<0.005 ohm="">

F84

 

COV KHOOM NEEG KHOOM UA NTEJ

Parameter

Prime

Saib / Kuaj A

Kev xeem

ASTM txujci

Ncauj

100 ± 0.2 hli

100 ± 0.2 hli

100 ± 0.5 hli

F613

Thickness

525 ± 20 μm (txuj)

525 ± 25 μm (tus qauv) 381 ± 25 μm 625 ± 25 μm 700 ± 25 μm 800 ± 25 μm 1000 ± 25 μm 1500 ± 25 μm

525 ± 50 μm (txuj)

F533

TTV

<5>

<10>

<15>

F657

Hneev nti

<30>

<30>

<40>

F657

Qhwv

<30>

<30>

<40>

F657

Ntug Rounding

SEMI-STD

F928

Npav

SEMI-STD Flats, Lub tsev SEMI-Caij Ntaus Xwb

F26, F671

  

DAB TSI ZOO

Parameter

Prime

Saib / Kuaj A

Kev xeem

ASTM txujci

Pem Sij Hawm Sab Nraud

Cov teeb meem saum npoo av

Tshuaj Mechanical Polished

Tshuaj Mechanical Polished

Tshuaj Mechanical Polished

F523

Deg Roughness

<2 a="">

<2 a="">

<2 a="">


Kev puas tsuaj, Phiv @> 0.3 μm

= 20

= 20

= 30

F523

Npau Taws, Dej Txhaum, Txiv Hlis Txiv Plaub

Tsis muaj

Tsis muaj

Tsis muaj

F523

Pom Cov Cim, Kev Hloov

Tsis muaj

Tsis muaj

Tsis muaj

F523

Rov Qab Saum Npe

Cracks, crowsfeet, pom cov cim, cov xim

Tsis muaj

Tsis muaj

Tsis muaj

F523

Cov teeb meem saum npoo av

Caustic etched

F523

  

Product description

Microelectronics 'khoom kab muaj ob qho tib si sab polished (SSP) thiab ob sab sab polished (DSP) wafer substrates. Ob tog sab polished wafers feem ntau yuav tsum muaj nyob rau hauv semiconductor, MEMS, thiab lwm yam kev siv cov wafers nrog cov yeeb yam uas nruj nreem nyob rau hauv.

 

Peb kuj muab qov plaub thiab plaub wafer daim. Kev ua tau zoo tiag tiag ntawm ntug ntev rau silicon wafers yog 5 x 5 mm2 ... 100 x 120 mm2 thiab lwm yam. Tus nqi / cov khoom wafer nyob ntawm cov khoom raws li tau zoo nyob rau hauv tus xov tooj ntawm cov wafer daim yuav tsum tau.

 

Customized dicing thiab polishing yog ib qho tseem avaible raws li koj xav tau. Thov tuaj yeem tiv tauj peb.

 

Khoom nta

·          4 "P / N hom, Polished silicon wafer (25 phaj)

·          Orientation: 100

·          Txuj ci: 0.1 - 40 Ohm · cm (Nws yuav txawv ntawm batch mus rau batch)

·          Thickness: 525 +/- 20um

·          Prime / Saib / Kev Ntsuam Xyuas Qib


 

Cim npe nrov: 4 nti (100mm) wafer, Suav teb, lwm tus neeg, manufacturers, hoobkas, ua nyob rau hauv Suav teb

Xa kev nug
Yuav daws cov teeb meem zoo li cas tom qab muag?
Nqa cov duab ntawm cov teeb meem thiab xa tuaj rau peb.Tom qab paub meej cov teeb meem, peb
yuav ua kom txaus siab rau koj hauv ob peb hnub.
tiv tauj peb