Ib txoj kev tshaj tawm yog ua raws txoj kev ntawm kev nce qhov dav thoob plaws ntawm monocrystalline wafer los ntawm 125mm mus rau 156mm, thiab nce qhov loj ntawm qhov hloov kho, xws li 158.75mm pseudo-squaremonocrystallinewafer lossis puv xwmfabmonocrystallinewafer (wafer dimameter 223mm). Tus158.75mmtag nrho cov squaremonocrystallinewafer (wafer dimameter 223mm) nce thaj tsam wafer li ntawm 3.1% piv rau M2 hom ntawv, uas ua rau kom lub zog ntawm 60-cell module los ntawm ze li 10Wp.
1 Cov khoom muaj zog
Cov cuab yeej | Specification | Kev Soj Ntsuam Cov Qauv |
Txoj kev loj hlob | CZ | |
Crystallinity | Monocrystalline | Qhov Tshaj Tawm Etch Txuj Ci（ASTM F47-88） |
Kev Coj Yam | P-hom | Napson EC-80TPN P/N |
Dopant | Boron, Gallium | - |
Cov pa oxygen [Oi] | ≦8E+17 ntawm / cm3 | FTIR (ASTM F121-83) |
Cov pa roj carbon concentration [Cs] | ≦5E+16 ntawm / cm3 | FTIR (ASTM F123-91) |
Etch qhov ceev (dislocation ntom) | ≦500 cm-3 | Qhov Tshaj Tawm Etch Txuj Ci（ASTM F47-88） |
Kev taw qhia sab npoo | & lt; 100> ± 3 ° | Kev Siv Tshuab Xaj Hluav Taws Xob (ASTM F26-1987) |
Qhia ntawm pseudo square sab | & lt; 010> ;,< 001=""> ± 3 ° | Kev Siv Tshuab Xaj Hluav Taws Xob (ASTM F26-1987) |
2 Cov khoom hluav taws xob
Cov cuab yeej | Specification | Kev Soj Ntsuam Cov Qauv |
Cov ua tau tiv | 0.5-1.5 Ωcm | Wafer xyuas system |
MCLT (haiv neeg tsawg cov neeg nqa khoom lub neej) | ≧50 μs | Sinton BCT-400 (nrog kev nce qib: 1E15 cm-3) |
3Ntsuas
Cov cuab yeej | Specification | Kev Soj Ntsuam Cov Qauv |
Ntsuas | Puv xwm txheej | |
Wafer Sab ntev | 158.75 ± 0.25 hli | wafer tshuaj xyuas system |
Wafer Txoj kab uas hla | φ223 ± 0.25 hli | wafer tshuaj xyuas system |
Lub kaum sab xis ntawm ib sab uas nyob ib sab | 90° ± 0.2° | wafer tshuaj xyuas system |
Thickness | 180﹢20/﹣10 µm; 170﹢20/﹣10 µm | wafer tshuaj xyuas system |
TTV (Tag nrho cov tuab sib txawv) | ≤27 µm | wafer tshuaj xyuas system |
4 Nto thaj chaw
Cov cuab yeej | Specification | Kev Soj Ntsuam Cov Qauv |
Txiav qauv | DW | -- |
Deg zoo | raws li txiav thiab ntxuav, tsis muaj paug pom tshwm sim, (roj lossis roj, ntiv tes luam tawm, xab npum ntxuav, tsuj nplawm, epoxy / kua nplaum tsis pub) | wafer tshuaj xyuas system |
Pom cov cim / kauj ruam | ≤ 15µm | wafer tshuaj xyuas system |
Hneev | ≤ 40 µm | wafer tshuaj xyuas system |
Warp | ≤ 40 µm | wafer tshuaj xyuas system |
Nti | qhov tob ≤0.3mm thiab ntev ≤ 0.5 hli Max 2 / pcs; tsis muaj V-chip | Looj ob lub qhov muag lossis lub tshuab ua haujlwm soj ntsuam |
Cov kab nrib pleb me / qhov | Txwv tsis pub | wafer tshuaj xyuas system |
Cim npe nrov: p hom puv square monocrystalline hnub ci wafer, Tuam Tshoj, cov chaw muag khoom, chaw tsim khoom, Hoobkas, ua nyob rau hauv Suav teb
