Khoom Taw Qhia
Khoom Siv Khoom
| Hmoov av - dawb specifications | 6" | 8" | 12" |
| Kev Loj Hlob Qauv | CZ | CZ | CZ |
| Inch (hli) | 150±0.5 | 200±0.5 | 300±0.5 |
| Hom / Dopant: | P / boron lossis n / p | P / boron lossis n / p | P / boron lossis n / p |
| Thickness (μm) | 625±25/675±25 | 725±25 | 775±25 |
| Resiveivity | 1–100Ω | 1–100Ω | 1–100Ω |
| Tiaj / MECH | Flats / neebt | Flats / neebt | Nthuav tawm |
| Nto tas | Raws li - txiav / lapped / etched / SSP / DSP | Raws li - txiav / lapped / etched / SSP / DSP | Raws li - txiav / lapped / etched / SSP / DSP |
| Customized specifications muaj | |||
Hmoov av - free wafers tau tsim rau cov xwm txheej uas cov khoom ruaj khov thiab cov txheej txheem xwm txheej feem ntau. Lawv tsis yog npaj rau kev tsim txom zaum kawg, tab sis lawv pab ua kom semicondire cov cuab yeej huv si, ntsuas, thiab khiav kom zoo ua ntej cov khoom lag luam wafers nkag mus rau kab. Nrog meej meej txoj kab tswj, muaj ntau qhov chaw sib txawv, thiab ntau yam Wafers ua tiav thiab tus nqi hloov kho tau zoo rau cov khoom thiab kev tshawb fawb.
Khoom nta
Qhov ntau thiab tsawg:6 ", 8", thiab 12 "
Txoj Kev Loj Hlob:CZ (Czochralski) Txheej Txheem
Txoj taub no tsis kam:150 ± 0.5 hli, 200 ± 0.5 hli, 300 ± 0.5 hli
Doping xaiv:P - hom (boron) lossis n - hom (phosphorus)
Qhov tuab:625-775 μm (nyob ntawm Wafer loj)
Resistivity ntau: 1–100 Ω
Tiaj / Untch Xaiv:Flats los yog nainch
Nto tas:Raws li - txiav, lapped, etched, SSP, DSP
Customizable:Cov lus qhia cov lus qhia tshwj xeeb muaj
Cim npe nrov: hmoov av - Free wafer, Suav teb, cov chaw muag khoom, chaw tsim khoom, Hoobkas, ua nyob rau hauv Suav teb
