Khoom Taw Qhia


Khoom Siv Khoom
Chaw ua uas tsis tau haus | Tus yam ntxwv | ASTM tswj txoj kev |
Hom / Dopant | P, boron n, phosphorous n, anties n, arsenic | F42 |
Kev txhawb nqa | <100>, <111>hlais tawm cov kev taw qhia rau cov neeg siv khoom tshwj xeeb | F26 |
Oxygen Cov Ntsiab Lus | 1019 ppma kev cai zam rau cov neeg siv khoom tshwj xeeb | F121 |
Cov ntsiab lus carbon | < 0.6 ppmA | F123 |
RESPEIGITNIENTY-P, BORON- N, Posphorous- N, Antma- N, Arsenic | 0.001 - 50 Ohm cm | F84 |
Cov Khoom Siv Neeg Kho Tshuab
Chaw ua uas tsis tau haus | Nyoo | Saib Xyuas / Kuaj A | Xeem ntawv | ASTM Txuj Kev |
Qhov dav | 300 ± 0.2 hli | 300 ± 0.2 hli | 300 ± 0.5 hli | F613 |
Qhov tuab | 775 ± 20 μm (tus qauv) | 775 ± 25 ± 25 ± 25 ± 25 ± 25 ± 25 ± 25 ± 25 ± 25 μm 15 ± 25 μm | 775 ± 50 μm (tus qauv) | F533 |
Ttv | < 5 µm | < 10 µm | < 15 µm | F657 |
Txoj hluas | < 30 µm | < 30 µm | < 50 µm | F657 |
Qhwv | < 30 µm | < 30 µm | < 50 µm | F657 |
Ntug rounding | Semi-std | F928 | ||
Kev cim | Thawj lub semi-pav xwb, Semi-Std flats Jeida tiaj tus, thatch | F26, F671 | ||
Nto Zoo
Chaw ua uas tsis tau haus | Nyoo | Saib Xyuas / Kuaj A | Xeem ntawv | ASTM Txuj Kev |
Pem Hauv Ntej Sab | ||||
Qhov xwm txheej nto | Tshuaj Kho Mob Kho Siab Ua Txhua Yam | Tshuaj Kho Mob Kho Siab Ua Txhua Yam | Tshuaj Kho Mob Kho Siab Ua Txhua Yam | F523 |
Nto roughness | < 2 A° | < 2 A° | < 2 A° | |
Contamination,Particles @ >0.3 µm | = 20 | = 20 | = 30 | F523 |
Pos huab, pits, txiv kab ntxwv tev | Tsis muaj | Tsis muaj | Tsis muaj | F523 |
Pom cov cim, striations | Tsis muaj | Tsis muaj | Tsis muaj | F523 |
Thaub qab cov qauv | ||||
Cov kab nrib pleb, crowsfeet, pom cov cim, stains | Tsis muaj | Tsis muaj | Tsis muaj | F523 |
Qhov xwm txheej nto | Caustic Etched | F523 | ||
Khoom Piav Qhia
Zoo meej rau cov ntawv thov microfluidics. Rau cov ntawv thov microelectronic lossis memss, thov hu rau peb kom cov ncauj lus kom ntxaws.
Thaum lub sijhawm semiconductor cov khoom siv txuas ntxiv mus rau qhov ua kom txaus ntshai, nws yog qhov tseem ceeb ntxiv rau Wafers kom muaj cov khoom siab zoo ntawm lawv sab nraub qaum thiab sab nraub qaum. Tam sim no cov wafers no feem ntau muaj nyob rau hauv microelectromechanical system (mem Microelectronic lees paub cov kev hloov ntawm semiconductor kev lag luam thiab tau cog lus los nrhiav cov kev daws teeb meem ntev rau txhua tus neeg siv khoom.
Cov khoom loj ntawm ob sab polished wafers hauv txhua wafer diameters diameters los ntawm 100mm rau 300mm. Yog tias koj cov lus qhia tshwj xeeb tsis muaj nyob hauv peb cov lus nug, peb tau tsim kev sib raug zoo ntev nrog cov neeg muag khoom ntev uas muaj peev xwm ua tau txhua qhov tshwj xeeb. Ob sab sab polished wafers muaj nyob hauv silicon, iav thiab lwm yam khoom siv feem ntau siv nyob rau hauv kev lag luam semiconduct.
Customized dicing thiab polishing tseem avaible raws li koj cov kev xav tau. Thov koj xav tiv tauj peb.
Khoom nta
· 12 "P / N Hom, Polished Silicon Wafer (25 Pcs)
· Orientation: 300
· Resistivity: {{0.1 - 40 Ohm • cm (nws yuav txawv ntawm batch rau batch)
· Thickness: {775+ / - 20um
· Prime / Soj Ntsuam / Kev Ntsuas Qib
Cim npe nrov: 12 nti (300 hli) wafer, Suav teb, cov chaw muag khoom, chaw tsim khoom, Hoobkas, ua nyob rau hauv Suav teb








