12 Nti (300mm) Wafer

12 Nti (300mm) Wafer

Cov khoom loj ntawm ob sab polished wafers hauv txhua wafer diameters diameters los ntawm 100mm rau 300mm. Yog tias koj cov lus qhia tshwj xeeb tsis muaj nyob hauv peb cov lus nug, peb tau tsim kev sib raug zoo ntev nrog cov neeg muag khoom ntev uas muaj peev xwm ua tau txhua qhov tshwj xeeb. Ob sab sab polished wafers muaj nyob hauv silicon, iav thiab lwm yam ntaub ntawv siv nyob rau hauv semiconductor kev lag luam thiab polishing tseem avaible raws li koj cov kev xav tau. Thov koj xav tiv tauj peb.
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Tsham tam sim no
Hauj lwm lawm
Kev tsis


Khoom Taw Qhia


 12 inch(300mm) Polished Wafer DSC01251 730


12 inch(300mm) Polished Wafer DSC01700 730


Khoom Siv Khoom


Chaw ua uas tsis tau haus

Tus yam ntxwv

ASTM tswj txoj kev

Hom / Dopant

P, boron n, phosphorous n, anties n, arsenic

F42

Kev txhawb nqa

<100>,   <111>hlais tawm cov kev taw qhia rau cov neeg siv khoom tshwj xeeb

F26

Oxygen Cov Ntsiab Lus

1019 ppma kev cai zam rau cov neeg siv khoom tshwj xeeb

F121

Cov ntsiab lus carbon

< 0.6   ppmA

F123

RESPEIGITNIENTY-P, BORON- N, Posphorous- N, Antma- N, Arsenic

0.001 - 50 Ohm cm
0.1 - 40 Ohm cm
0.005 - 0.025 Ohm cm
<0.005 Ohm cm

F84


Cov Khoom Siv Neeg Kho Tshuab


Chaw ua uas tsis tau haus

Nyoo

Saib Xyuas / Kuaj A

Xeem ntawv

ASTM Txuj Kev

Qhov dav

300 ± 0.2 hli

300 ± 0.2 hli

300 ± 0.5 hli

F613

Qhov tuab

775 ± 20 μm (tus qauv)

775 ± 25 ± 25 ± 25 ± 25 ± 25 ± 25 ± 25 ± 25 ± 25 μm 15 ± 25 μm

775 ± 50 μm (tus qauv)

F533

Ttv

< 5 µm

< 10 µm

< 15 µm

F657

Txoj hluas

< 30 µm

< 30 µm

< 50 µm

F657

Qhwv

< 30 µm

< 30 µm

< 50 µm

F657

Ntug rounding

Semi-std

F928

Kev cim

Thawj lub semi-pav xwb, Semi-Std flats Jeida tiaj tus, thatch

F26, F671


Nto Zoo


Chaw ua uas tsis tau haus

Nyoo

Saib Xyuas / Kuaj A

Xeem ntawv

ASTM Txuj Kev

Pem Hauv Ntej Sab

Qhov xwm txheej nto

Tshuaj Kho Mob Kho Siab Ua Txhua Yam

Tshuaj Kho Mob Kho Siab Ua Txhua Yam

Tshuaj Kho Mob Kho Siab Ua Txhua Yam

F523

Nto roughness

< 2 A°

< 2 A°

< 2 A°


Contamination,Particles   @ >0.3 µm

= 20

= 20

= 30

F523

Pos huab, pits, txiv kab ntxwv tev

Tsis muaj

Tsis muaj

Tsis muaj

F523

Pom cov cim, striations

Tsis muaj

Tsis muaj

Tsis muaj

F523

Thaub qab cov qauv

Cov kab nrib pleb, crowsfeet, pom cov cim, stains

Tsis muaj

Tsis muaj

Tsis muaj

F523

Qhov xwm txheej nto

Caustic Etched

F523

 

Khoom Piav Qhia


Zoo meej rau cov ntawv thov microfluidics. Rau cov ntawv thov microelectronic lossis memss, thov hu rau peb kom cov ncauj lus kom ntxaws.

 

Thaum lub sijhawm semiconductor cov khoom siv txuas ntxiv mus rau qhov ua kom txaus ntshai, nws yog qhov tseem ceeb ntxiv rau Wafers kom muaj cov khoom siab zoo ntawm lawv sab nraub qaum thiab sab nraub qaum. Tam sim no cov wafers no feem ntau muaj nyob rau hauv microelectromechanical system (mem Microelectronic lees paub cov kev hloov ntawm semiconductor kev lag luam thiab tau cog lus los nrhiav cov kev daws teeb meem ntev rau txhua tus neeg siv khoom.

Cov khoom loj ntawm ob sab polished wafers hauv txhua wafer diameters diameters los ntawm 100mm rau 300mm. Yog tias koj cov lus qhia tshwj xeeb tsis muaj nyob hauv peb cov lus nug, peb tau tsim kev sib raug zoo ntev nrog cov neeg muag khoom ntev uas muaj peev xwm ua tau txhua qhov tshwj xeeb. Ob sab sab polished wafers muaj nyob hauv silicon, iav thiab lwm yam khoom siv feem ntau siv nyob rau hauv kev lag luam semiconduct.

Customized dicing thiab polishing tseem avaible raws li koj cov kev xav tau. Thov koj xav tiv tauj peb.

 

Khoom nta


·         12 "P / N Hom, Polished Silicon Wafer (25 Pcs)

·         Orientation: 300

·         Resistivity: {{0.1 - 40 Ohm • cm (nws yuav txawv ntawm batch rau batch)

·         Thickness: {775+ / - 20um

·         Prime / Soj Ntsuam / Kev Ntsuas Qib





Cim npe nrov: 12 nti (300 hli) wafer, Suav teb, cov chaw muag khoom, chaw tsim khoom, Hoobkas, ua nyob rau hauv Suav teb

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